Search for: All records

Abstract Thermally activated annealing in semiconductors faces inherent limitations, such as dopant diffusion. Here, a nonthermal pathway is demonstrated for a complete structural restoration in predamaged germanium via ionization‐induced recovery. By combining experiments and modeling, this study reveals that the energy transfer of only 2.4 keV nm⁻¹from incident ions to target electrons can effectively annihilate pre‐existing defects and restore the original crystalline structure at room temperature. Moreover, it is revealed that the irradiation‐induced crystalline‐to‐amorphous (c/a) transformation in Ge is reversible, a phenomenon previously considered unattainable without additional thermal energy imposed during irradiation. For partially damaged Ge, the overall damage fraction decreases exponentially with increasing fluence. Surprisingly, the recovery process in preamorphized Ge starts with defect recovery outside the amorphous layer and a shrinkage of the amorphous thickness. After this initial stage, the remaining damage decreases slowly with increasing fluence, but full restoration of the pristine state is not achieved. These differences in recovery are interpreted in the framework of structural differences in the initial defective layers that affect recovery kinetics. This study provides new insights on reversing the c/a transformation in Ge using highly‐ionizing irradiation and has broad implications across materials science, radiation damage mitigation, and fabrication of Ge‐based devices.